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Reference (article)

A. Varea, E. Pellicer, S. Pané, B. J. Nelson, S. Suriñach, M. D. Baró, J. Sort, "Mechanical Properties and Corrosion Behaviour of Nanostructured Cu-rich CuNi Electrodeposited Films", International Journal of Electrochemical Science, Vol. 7, January 2012, pp. 1288-1302.

BibTeX entry

@ARTICLE{Varea_12_01,
	Author = {A. Varea and Eva Pellicer and Salvador Pané and Bradley J. Nelson and Santiago Suriñach and M. D. Baró and Jordi Sort},
	Title = {Mechanical Properties and Corrosion Behaviour of Nanostructured Cu-rich CuNi Electrodeposited Films},
	Journal = {International Journal of Electrochemical Science},
	Volume = {7},
	Month = {January},
	Year = {2012},
	Pages = {pp. 1288-1302},
	Abstract = {Nanocrystalline Cu-rich CuNi alloy thin films (with copper content ranging from 22 to 97 at%) have been grown by electrodeposition, using galvanostatic conditions in an electrolytic bath containing Ni and Cu sulphates with a [Ni(II)]/[Cu(II)] molar ratio of 11. The Cu content is tuned by varying the applied current density during deposition. The nanoscrystalline nature of Cu-rich CuNi thin films has been achieved using saccharine as a grain refinement agent, although for high Cu content (> 90 at%) the refinement effect is less pronounced. Due to the nanocrystalline character of the films, low surface roughness, good compactness, and outstanding mechanical properties (e.g. nanoindentation hardness values of approximately 7 GPa) are obtained, particularly for Cu percentages below 70 at%. The presence of stacking faults also contributes to the observed high strength. The films show good corrosion protective behaviour in a 3.5 wt% NaCl medium, with corrosion potentials more positive than the bare substrate (pure-Cu) and lower corrosion current density values ranging from 1.8 to 5.4 µA/cm2.}
}

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