Hybrid Approaches to NEMS
Top-Down Approaches: Nanolithography, Etching, FIB, Nanoimprinting
Bottom-Up Approaches: CVD, Self-Assembly, Directed Self-Assembly, FIB, EBID, DPL
Hybrid Approaches to NEMS: A combination for NEMS devices
NF-Nanofabrication, NA-Nanoassembly, PC-Property Characterization, NRM-Nanorobotic Manipulation
Nanofabrication
- E-beam Lithography: combining with PECVD for directed growth of vertically aligned nanotubes, and for nanoelectrodes for DEP assembly of lateral aligned nanotubes
E-beam or Photo Lithography: combining with epitaxial deposition, spinning and etching for SiGe/Si bilayer nanocoils
Nanorobotic Manipulation
- 3-D nanomanipulation in SEM and TEM: position and orientation
In situ property characterization: mechanical, electric, electromechanical, etc.
Nanostructuring: tailoring individual nanotubes
Nanoassembly: vdW, EBID and nanomechanochemical bonding
Group Members
- Prof. Brad Nelson, bnelson@ethz.ch
- Dr. Lixin Dong, ldong@ethz.ch
- Arunkumar Subramanian, arun@ethz.ch
- Dominik Bell, dbell@ethz.ch
